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Conductive Brush Ring overcomes current leakage in EV powertrains

SKF's new Conductive Brush Ring paves the way to greater reliability and longer life in high-performance electric vehicle powertrain systems. Using pure carbon fiber bristles, it provides a reliable electrical connection between an EV eAxle rotor shaft and its housing. When used in combination with SKF Hybrid ceramic ball bearings, it helps to alleviate parasitic current effects that can lead to premature failure in bearings and other components. Available in different configurations for wet (oil-lubricated) motor designs -- and soon for dry (sealed) applications.
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Intro to reed switches, magnets, magnetic fields

This brief introductory video on the DigiKey site offers tips for engineers designing with reed switches. Dr. Stephen Day, Ph.D. from Coto Technology gives a solid overview on reed switches -- complete with real-world application examples -- and a detailed explanation of how they react to magnetic fields.
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Bi-color LEDs to light up your designs

Created with engineers and OEMs in mind, SpectraBright Series SMD RGB and Bi-Color LEDs from Visual Communi-cations Company (VCC) deliver efficiency, design flexibility, and control for devices in a range of industries, including mil-aero, automated guided vehicles, EV charging stations, industrial, telecom, IoT/smart home, and medical. These 50,000-hr bi-color and RGB options save money and space on the HMI, communicating two or three operating modes in a single component.
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All about slip rings: How they work and their uses

Rotary Systems has put together a really nice basic primer on slip rings -- electrical collectors that carry a current from a stationary wire into a rotating device. Common uses are for power, proximity switches, strain gauges, video, and Ethernet signal transmission. This introduction also covers how to specify, assembly types, and interface requirements. Rotary Systems also manufactures rotary unions for fluid applications.
Read the overview.

Seifert thermoelectric coolers from AutomationDirect

Automation-Direct has added new high-quality and efficient stainless steel Seifert 340 BTU/H thermoelectric coolers with 120-V and 230-V power options. Thermoelectric coolers from Seifert use the Peltier Effect to create a temperature difference between the internal and ambient heat sinks, making internal air cooler while dissipating heat into the external environment. Fans assist the convective heat transfer from the heat sinks, which are optimized for maximum flow.
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EMI shielding honeycomb air vent panel design

Learn from the engineering experts at Parker how honeycomb air vent panels are used to help cool electronics with airflow while maintaining electromagnetic interference (EMI) shielding. Topics include: design features, cell size and thickness, platings and coatings, and a stacked design called OMNI CELL construction. These vents can be incorporated into enclosures where EMI radiation and susceptibility is a concern or where heat dissipation is necessary. Lots of good info.
Read the Parker blog.

What is 3D-MID? Molded parts with integrated electronics from HARTING

3D-MID (three-dimensional mechatronic integrated devices) technology combines electronic and mechanical functionalities into a single, 3D component. It replaces the traditional printed circuit board and opens up many new opportunities. It takes injection-molded parts and uses laser-direct structuring to etch areas of conductor structures, which are filled with a copper plating process to create very precise electronic circuits. HARTING, the technology's developer, says it's "Like a PCB, but 3D." Tons of possibilities.
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Loss-free conversion of 3D/CAD data

CT CoreTech-nologie has further developed its state-of-the-art CAD converter 3D_Evolution and is now introducing native interfaces for reading Solidedge and writing Nx and Solidworks files. It supports a wide range of formats such as Catia, Nx, Creo, Solidworks, Solidedge, Inventor, Step, and Jt, facilitating smooth interoperability between different systems and collaboration for engineers and designers in development environments with different CAD systems.
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Top 5 reasons for solder joint failure

Solder joint reliability is often a pain point in the design of an electronic system. According to Tyler Ferris at ANSYS, a wide variety of factors affect joint reliability, and any one of them can drastically reduce joint lifetime. Properly identifying and mitigating potential causes during the design and manufacturing process can prevent costly and difficult-to-solve problems later in a product lifecycle.
Read this informative ANSYS blog.

Advanced overtemp detection for EV battery packs

Littelfuse has introduced TTape, a ground-breaking over-temperature detection platform designed to transform the management of Li-ion battery systems. TTape helps vehicle systems monitor and manage premature cell aging effectively while reducing the risks associated with thermal runaway incidents. This solution is ideally suited for a wide range of applications, including automotive EV/HEVs, commercial vehicles, and energy storage systems.
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Benchtop ionizer for hands-free static elimination

EXAIR's Varistat Benchtop Ionizer is the latest solution for neutralizing static on charged surfaces in industrial settings. Using ionizing technology, the Varistat provides a hands-free solution that requires no compressed air. Easily mounted on benchtops or machines, it is manually adjustable and perfect for processes needing comprehensive coverage such as part assembly, web cleaning, printing, and more.
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LED light bars from AutomationDirect

Automation-Direct adds CCEA TRACK-ALPHA-PRO series LED light bars to expand their offering of industrial LED fixtures. Their rugged industrial-grade anodized aluminum construction makes TRACKALPHA-PRO ideal for use with medium to large-size industrial machine tools and for use in wet environments. These 120 VAC-rated, high-power LED lights provide intense, uniform lighting, with up to a 4,600-lumen output (100 lumens per watt). They come with a standard bracket mount that allows for angle adjustments. Optional TACLIP mounts (sold separately) provide for extra sturdy, vibration-resistant installations.
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World's first metalens fisheye camera

2Pi Optics has begun commercial-ization of the first fisheye camera based on the company's proprietary metalens technology -- a breakthrough for electronics design engineers and product managers striving to miniaturize the tiny digital cameras used in advanced driver-assistance systems (ADAS), AR/VR, UAVs, robotics, and other industrial applications. This camera can operate at different wavelengths -- from visible, to near IR, to longer IR -- and is claimed to "outperform conventional refractive, wide-FOV optics in all areas: size, weight, performance, and cost."
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Orbex offers two fiber optic rotary joint solutions

Orbex Group announces its 700 Series of fiber optic rotary joint (FORJ) assemblies, supporting either single or multi-mode operation ideal for high-speed digital transmission over long distances. Wavelengths available are 1,310 or 1,550 nm. Applications include marine cable reels, wind turbines, robotics, and high-def video transmission. Both options feature an outer diameter of 7 mm for installation in tight spaces. Construction includes a stainless steel housing.
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Mini tunnel magneto-resistance effect sensors

Littelfuse has released its highly anticipated 54100 and 54140 mini Tunnel Magneto-Resistance (TMR) effect sensors, offering unmatched sensitivity and power efficiency. The key differentiator is their remarkable sensitivity and 100x improvement in power efficiency compared to Hall Effect sensors. They are well suited for applications in position and limit sensing, RPM measurement, brushless DC motor commutation, and more in various markets including appliances, home and building automation, and the industrial sectors.
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Department of Defense names 8 new U.S. Microelectronics Commons hub locations

Deputy Secretary of Defense Kathleen Hicks speaks to members of the media at the Pentagon, announcing approximately $240 million in awards for the establishment of innovation hubs, Sept. 20, 2023. [Credit: Photo by Air Force Tech Sgt. Jack Sanders]

 

 

 

 

By C. Todd Lopez, DOD

Under the CHIPS and Science Act, the Defense Department (DOD) recently announced the award of nearly $240 million dollars to eight regional "innovation hubs" around the United States that will be a part of the Microelectronics Commons, and that will benefit both the department and the United States by spurring development of a domestic microelectronics manufacturing industry.

"The Microelectronics Commons is focused on bridging and accelerating the 'lab-to-fab' transition, that infamous valley of death between research and development and production," said Deputy Defense Secretary Kathleen Hicks during a briefing Sept. 20 at the Pentagon. "While America is a world leader in the innovative research and design of microelectronics, we've lagged in the ability to prototype, manufacture, and produce them at scale. That's what the CHIPS Act is meant to supercharge."

The eight hubs will focus on microelectronic development in areas like electromagnetic warfare; secure computing at the tactical edge and the internet of things; artificial intelligence hardware; 5G and 6G wireless; and quantum technology, Hicks said.

The eight regional hubs include:

• The Northeast Microelectronics Coalition Hub. This hub is led by the Massachusetts Technology Collaborative in Massachusetts, has 90 hub members, and has been awarded $19.7 million.
• The Silicon Crossroads Microelectronics Commons Hub. This hub is led by the Applied Research Institute in Indiana, has 130 hub members, and has been awarded $32.9 million.
• The California Defense Ready Electronics and Microdevices Superhub Hub. This hub is led by the University of Southern California in California, has 16 hub members, and has been awarded $26.9 million.
• The Commercial Leap Ahead for Wide Bandgap Semiconductors Hub. This hub is led by the North Carolina State University in North Carolina, has seven hub members, and has been awarded $39.4 million.
• The Southwest Advanced Prototyping Hub. This hub is led by the Arizona Board of Regents on behalf of Arizona State University in Arizona, has 27 hub members, and has been awarded $39.8 million.
• The Midwest Microelectronics Consortium Hub in Ohio. This hub has 65 hub members and has been awarded $24.3 million.
• The Northeast Regional Defense Technology Hub. This hub is led by the Research Foundation for the State University of New York in New York, has 51 hub members, and has been awarded $40 million.
• The California-Pacific-Northwest AI Hardware Hub. This hub is led by the Board of Trustees of the Leland Stanford Junior University in California, has 44 hub members, and has been awarded $15.3 million.

"Consistent with our warfighter-centric approach, the Microelectronics Commons will get the most cutting-edge microchips into systems our troops use every day: ships, planes, tanks, long-range munitions, communications gear, sensors, and much more ... including the kinds of all-domain, attritable autonomous systems that we'll be fielding through DOD's recently announced Replicator initiative," Hicks said.

Today, the United States is responsible for only about 12% of microelectronics production globally, with most production now in Asia. The U.S. also lacks much of the capacity to confirm the viability and marketability of new microelectronics technologies in ways that might convince American industry to invest in them.

The Defense Department-led Microelectronics Commons aims to close the gaps that exist now which prevent the best ideas in technology from reaching the market.

With the Microelectronics Commons, novel technology developed domestically will have a better chance of making it from lab to market entirely inside the United States. The commons will ensure American ingenuity stays inside the U.S. and isn't stolen by adversaries, and that the nation rebuilds the capacity to do on its own what it must now depend on foreign nations to do.

"These hubs are not just vital to American scientific, manufacturing, and economic competitiveness," Hicks said. "They will also directly contribute to this Department's national defense mission."

Published October 2023

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